When things go wrong on a zinc electroplating line, quick solutions can save thousands of dollars. If the answer is not pre- or post-treatment, the laboratory is the place to troubleshoot the plating bath. A quick analysis and a few hull cells may be all it takes to put the operation back on its feet. This paper deals with the investigative process in the laboratory.
First things First
Quick solutions to problems on an electroplating line can save thousands of dollars. Experience is by far the most valuable tool a troubleshooter can possess. So successful troubleshooting begins when the line is at its best! Build your experience by walking the line when everything is running smoothly. Take note of solution color, smells, gage settings, etc. Intimate knowledge of your plating line and its idiosyncrasies will expedite the solution to future problems.
Read the rest of this entry »
Electroplating is a process used to reduce the positively charged ions of a desired material, with the help of an electric current. The process also coats a conductive object with a thin layer of the material, such as a metal. Zinc electroplating is one of the most common forms of electroplating and popular because of its relatively low cost, protective nature and attractive appearance. The coating done through this process gives corrosion protection to ferrous components and it can give colors like gold, black or olive drab finish, by post treatment.
Read the rest of this entry »
In another form of barrel plating operation, the parts lie at the bottom of an open cup-shaped tub rotatable about an axis at about 45o to the horizontal. There is a negative contact sited centrally in the base, and an anode is hung above the parts. The tub is filled with plating solution and rotated. For removal, the contents are dumped out through a sieve. Barrel plating does not produce such satisfactory deposits as tank plating, for the action on any one parts is at best intermittent and some parts may receive an inordinately thin deposit.
Read the rest of this entry »
Driven by the need for increased speed, portability and wiring density, the interconnect pitch on semiconductor packages, and the corresponding high density interconnect (HDI) substrates, continue to shrink. The combination of filled blind microvias and build-up technology provides a means to achieve the required wiring densities. With the rapid growth of this technology, the use of electrodeposited copper for filling blind microvias has become a widely adopted process for manufacture of both HDI printed circuit boards (PCBs) and also semiconductor package substrates.
Read the rest of this entry »