HNKTech Europe Ltd. (Wimbledon, UK), a consultancy and developer ofcustomized FEA (finite element analysis) solutions, now offerssimulation software for electroplating components. The softwareproduces highly accurate coating uniformity, says the company, andreduces wastage costs, improves product quality, and time to market.
Traditional electroplating of such components as bearings, pistons, andlanding gear parts often results in an uneven finish as well as wastageas the plating technician tries to achieve uniformity through grindingand polishing. HNKTech’s FEA software works by creating a densitymodel. The model is displayed after inputting your electroplatingset-up including the geometric profile, material properties, andboundary conditions. Using these variables, the software simulates theelectroplating process then displays the density model with predictedplating thickness and uniformity.
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When things go wrong on a zinc electroplating line, quick solutions can save thousands of dollars. If the answer is not pre- or post-treatment, the laboratory is the place to troubleshoot the plating bath. A quick analysis and a few hull cells may be all it takes to put the operation back on its feet. This paper deals with the investigative process in the laboratory.
First things First
Quick solutions to problems on an electroplating line can save thousands of dollars. Experience is by far the most valuable tool a troubleshooter can possess. So successful troubleshooting begins when the line is at its best! Build your experience by walking the line when everything is running smoothly. Take note of solution color, smells, gage settings, etc. Intimate knowledge of your plating line and its idiosyncrasies will expedite the solution to future problems.
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Driven by the need for increased speed, portability and wiring density, the interconnect pitch on semiconductor packages, and the corresponding high density interconnect (HDI) substrates, continue to shrink. The combination of filled blind microvias and build-up technology provides a means to achieve the required wiring densities. With the rapid growth of this technology, the use of electrodeposited copper for filling blind microvias has become a widely adopted process for manufacture of both HDI printed circuit boards (PCBs) and also semiconductor package substrates.
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Flexible printed circuit boards (FPCs) are applied to various electronic devices due to their mechanical characteristics and are indispensable to electronic devices requiring system miniaturization, weight reduction and multi-functionality. This article describes a new electrolytic copper plating technology which is an essential step in the manufacturing process of FPCs. This new electrolytic copper plating technology improves the manufacturing process and realizes higher functionality.
Application of FPC
FPCs are employed in a wide variety of applications due to the nature of their characteristics. Examples of applications for FPCs include cell-phone liquid crystal display enclosure, hinge parts, keypad, battery enclosure and interface components. FPCs are also used in optical pickup and device interfaces inside hard disk drives, digital still cameras and digital camcorders. Desired performance characteristics are: 1) wiring within small spaces; 2) wiring connection accompanied by mechanical functions within working part/device and motherboard; and 3) high density interconnect resulting from denser and narrower features.
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