HNKTech Europe Ltd. (Wimbledon, UK), a consultancy and developer ofcustomized FEA (finite element analysis) solutions, now offerssimulation software for electroplating components. The softwareproduces highly accurate coating uniformity, says the company, andreduces wastage costs, improves product quality, and time to market.
Traditional electroplating of such components as bearings, pistons, andlanding gear parts often results in an uneven finish as well as wastageas the plating technician tries to achieve uniformity through grindingand polishing. HNKTech’s FEA software works by creating a densitymodel. The model is displayed after inputting your electroplatingset-up including the geometric profile, material properties, andboundary conditions. Using these variables, the software simulates theelectroplating process then displays the density model with predictedplating thickness and uniformity.
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Updating its DOS-based software, the company introduces DynaComm II, a 32-bit, Windows-based software that operates under any of the current platforms available (95/98/NT/CE). Employing either the simple point-and-click or touch-screen technology common for Windows applications, DynaComm II provides an electroplating process control program for the PRO-Series and DC rectifiers.
This program consists of an Operator Interface (OI) for parameter entry and display and a Control Server (CS) to control and monitor the rectifiers. These two applications use a Windows socket connection to interchange data using the Internet protocol. This two-part design allows DynaComm II to be installed on a single computer for a stand alone application or to be installed on separate computers where the operator’s and rectifier’s positions can be separated by feet or miles.
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Flexible printed circuit boards (FPCs) are applied to various electronic devices due to their mechanical characteristics and are indispensable to electronic devices requiring system miniaturization, weight reduction and multi-functionality. This article describes a new electrolytic copper plating technology which is an essential step in the manufacturing process of FPCs. This new electrolytic copper plating technology improves the manufacturing process and realizes higher functionality.
Application of FPC
FPCs are employed in a wide variety of applications due to the nature of their characteristics. Examples of applications for FPCs include cell-phone liquid crystal display enclosure, hinge parts, keypad, battery enclosure and interface components. FPCs are also used in optical pickup and device interfaces inside hard disk drives, digital still cameras and digital camcorders. Desired performance characteristics are: 1) wiring within small spaces; 2) wiring connection accompanied by mechanical functions within working part/device and motherboard; and 3) high density interconnect resulting from denser and narrower features.
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