here are certain timeless truths when it comes to printed circuits, and the more we stray from them, the more fervent our reaction when rediscovering them. Electrochemical deposition is going through such a revelation utilizing pulse reverse waveforms.
Electroplating was developed as a combination of Direct Current (DC) and a chemical bath. It was understood that this simple waveform and bath composition had considerable limitations. Numerous innovations followed to optimize the plating process for the desired deposit characteristics. There were advances in cell geometries, anode materials, temperature controls, monitoring, instrumentation and numerous others.
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When things go wrong on a zinc electroplating line, quick solutions can save thousands of dollars. If the answer is not pre- or post-treatment, the laboratory is the place to troubleshoot the plating bath. A quick analysis and a few hull cells may be all it takes to put the operation back on its feet. This paper deals with the investigative process in the laboratory.
First things First
Quick solutions to problems on an electroplating line can save thousands of dollars. Experience is by far the most valuable tool a troubleshooter can possess. So successful troubleshooting begins when the line is at its best! Build your experience by walking the line when everything is running smoothly. Take note of solution color, smells, gage settings, etc. Intimate knowledge of your plating line and its idiosyncrasies will expedite the solution to future problems.
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In another form of barrel plating operation, the parts lie at the bottom of an open cup-shaped tub rotatable about an axis at about 45o to the horizontal. There is a negative contact sited centrally in the base, and an anode is hung above the parts. The tub is filled with plating solution and rotated. For removal, the contents are dumped out through a sieve. Barrel plating does not produce such satisfactory deposits as tank plating, for the action on any one parts is at best intermittent and some parts may receive an inordinately thin deposit.
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Driven by the need for increased speed, portability and wiring density, the interconnect pitch on semiconductor packages, and the corresponding high density interconnect (HDI) substrates, continue to shrink. The combination of filled blind microvias and build-up technology provides a means to achieve the required wiring densities. With the rapid growth of this technology, the use of electrodeposited copper for filling blind microvias has become a widely adopted process for manufacture of both HDI printed circuit boards (PCBs) and also semiconductor package substrates.
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Updating its DOS-based software, the company introduces DynaComm II, a 32-bit, Windows-based software that operates under any of the current platforms available (95/98/NT/CE). Employing either the simple point-and-click or touch-screen technology common for Windows applications, DynaComm II provides an electroplating process control program for the PRO-Series and DC rectifiers.
This program consists of an Operator Interface (OI) for parameter entry and display and a Control Server (CS) to control and monitor the rectifiers. These two applications use a Windows socket connection to interchange data using the Internet protocol. This two-part design allows DynaComm II to be installed on a single computer for a stand alone application or to be installed on separate computers where the operator’s and rectifier’s positions can be separated by feet or miles.
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